CMC CuMoCu Caloris Sink
CMC CuMoCu Material Application
Low Expansion Layers and Thermal Paths for heat Sinks, Lead Frames, Multi-layer Printed Circuit Boards (PCBs) etc.
Materia in aircraft calor mergitur, materia caloris in radar descendunt.
CMC Caloris Sink Commoda
1. CMC composita novum processum adhibet, multilayer aeris-molybdaeni aeris, compago aeris et molybdaeni stricta, neque hiatus, neque oxidatio interfacies fiet in subsequentibus volvendis calidis et calefactionibus, ita ut compages inter se convalescat. Molybdenum et cuprum optimum est, Ut materia perfecta expansionem coefficiens infimas scelerisque et optimas conductivity scelerisque habet;
2. Ratio aeris CMC molybdaeni valde bona est, et cuiusvis tabulatum declinatio intra 10% regitur; SCMC materia est multiplex materia composita. Compositio structuralis materiae a summo ad imum est: linteum aeris - schedam molybdaeni - schedam aeris - molybdaeni schedam aeneam, componi potest ex 5 stratis, 7 stratis, vel etiam pluribus stratis. Comparatus cum CMC, SCMC infimum expansionem scelerisque coefficiens habebit et summa conductivity scelerisque.
Gradus CMC Cu-Mo-Cu Materials
| Gradus | Densitas g/cm3 | Coefficiens scelerisqueExpansio ×10-6 (20℃) | Scelerisque conductivity W/(M·K) |
| CMC111 | 9.32 | 8.8 | 305（XY）/250（Z） |
| CMC121 | 9.54 | 7.8 | 260（XY）/210（Z） |
| CMC131 | 9.66 | 6.8 | 244（XY）/190Z） |
| CMC141 | 9.75 | 6 | 220（XY）/180（Z） |
| CMC13/74/13 | 9.88 | 5.6 | 200（XY）/170（Z） |
| Materia | Wt%Molybdenum Content | g/cm3Densitas | Scelerisque conductivity at 25℃ | Coefficiens scelerisqueExpansion at 25℃ |
| S-CMC | 5 | 9.0 | 362 | 14.8 |
| 10 | 9.0 | 335 | 11.8 | |
| 13.3 | 9.1 | 320 | 10.9 | |
| 20 | 9.2 | 291 | 7.4 |