CMC CuMoCu Calor Sink
CMC CuMoCu Material Application
Low Expansion Layers and Thermal Paths for heat Sinks, Lead Frames, Multi-layer Printed Circuit Boards (PCBs) etc.
Materia in aircraft calor mergitur, materia caloris in radar descendunt.
CMC Caloris Sink Commoda
1. CMC compositum novum processum adhibet, multilayer aeris, molybdaeno-aes, compago aeris et molybdaeni stricta, neque hiatus, neque oxidatio interfacies fiet in subsequentibus volvendis et calefactionibus calidis, ita ut compages inter se convalescat. Molybdenum et cuprum optimum est, Ut materia perfecta expansionem coefficiens infimas scelerisque et optimas conductivity scelerisque habet;
2. Ratio aeris CMC molybdaeni valde bona est, et cuiusvis tabulatum declinatio intra 10% regitur;SCMC materia est multiplex materia composita.Compositio structuralis materiae a summo ad imum est: linteum aeneum - molybdaenum - linteum aeneum - schedam molybdaenum.Comparatus cum CMC, SCMC infimum expansionem scelerisque coefficiens habebit et summa conductivity scelerisque.
Gradus CMC Cu-Mo-Cu Materials
| Gradus | Densitas g/cm3 | Coefficiens scelerisqueExpansio ×10-6 (20℃) | Scelerisque conductivity W/(M·K) |
| CMC111 | 9.32 | 8.8 | 305（XY）/250（Z） |
| CMC121 | 9.54 | 7.8 | 260（XY）/210（Z） |
| CMC131 | 9.66 | 6.8 | 244（XY）/190Z） |
| CMC141 | 9.75 | 6 | 220（XY）/180（Z） |
| CMC13/74/13 | 9.88 | 5.6 | 200（XY）/170（Z） |
| Materia | Wt%Molybdenum Content | g/cm3Density | Scelerisque conductivity at 25℃ | Coefficiens scelerisqueExpansion at 25℃ |
| S-CMC | 5 | 9.0 | 362 | 14.8 |
| 10 | 9.0 | 335 | 11.8 | |
| 13.3 | 9.1 | 320 | 10.9 | |
| 20 | 9.2 | 291 | 7.4 |